Session 1 | T1 - NBTI and PBTI - Fundamentals to Circuit Level Implications (Prof. Jianfu Zhang, Liverpool John Moores University, UK) | T2 - Physical Failure Analysis - Progress and Applications with Case Studies (Dr. David Wu, TSMC, Taiwan (Retired)) |
Session 2 | T3 - High Power Electronics Reliability (Prof. Francesco Iannuzzo, Aalborg University, Denmark) | T4 - 2.5D/3D Package Level Failure Analysis (Dr. Susan Li, Cypress Semiconductors, USA) |
Session 3 | T5 - MOL and BEOL Dielectrics and Interconnect Reliability (Dr. Baozhen Lin, IBM System and Technology Group, Essex Vermont, USA) | T6 - Electrical Fault Isolation - Laser Voltage Probing (Dr. Venkat Krishnan Ravikumar, AMD, Singapore) |
Session 4 | T7 - Heterogeneous Integration and Package Level Reliability (Dr. Chandrasekara Kothandaraman, IBM Research, Yorktown Heights, USA) | T8- Electrical Fault Isolation - LADA (Dr. Goh Szu-Huat, GlobalFoundries, Singapore) |
Note: Tutorial sessions arrangement are tentative and can be subjected to change
|