Session 1 | T1 - FinFET & Post-FinFET Advanced Logic Device Reliability– A Review (Prof. Aaron Thean, NUS , Singapore) | T2 - Perspectives of Fault Isolation and Technology Concepts for High Data Rate Ics (Prof. Christian Boit, Technical University of Berlin, Germany) |
Session 2 | T3 - BEOL Reliability; from FinFETs to More-than-Moore Device (Dr. Jeff Gambino, ON Semiconductor , USA) | T4 - SiP, Packaged Stacked Devices and other Challenging 3D Assembly Analysis (Dr. Philippe Perdu, CNES, France) |
Session 3 | T5 - Focused Ion Beam (FIB) Chip Circuit Edit Tutorial (Steven B. Herschbein, GLOBALFOUNDRIES, USA) | T6 - Physical Analysis with the TEM - Possibilities and Challenges (Dr. Michel Bosman, IMRE, Singapore) |
Session 4 | T7 - Intrinsic Reliability Challenges for Non-Volatile Memory Technologies (Dr. Robin Degraeve, IMEC , Belgium) | T8- Defect localization using SEM based current imaging (Michél Simon-Najasek, IMWS, Germany) |
Workshop (6.30 – 8.30pm) | Fault Isolation Workshop (Sponsored by Hamamatsu) (Light refreshment will be provided before the workshop) |