25th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

IPFA 2018

Participant Registration Page


REGISTRATION INFORMATION AND DEADLINE

All presenters and attendees must register online.

Fee is not prorated or refundable.

The registration fee includes the following:
- Attendance and materials for the tutorials and conference
- Luncheons and tea breaks for 16 to 19 July 2018
- 1 banquet ticket for 18 July 2018.

10% discount for groups of 5 or more (same organization).

The deadline for early bird registration is 20 May 2018.

Please contact the IPFA Secretariat if you need any assistance
Mrs Jasmine Leong
ieee_ipfa@singnet.com.sg
+65 6743 2523

Type of registration

Please choose 1 only
IEEE Member  
Non IEEE Member  
Student  
IEEE Membership No.  

Contact information

Title:  
First Name:  (*)
Family Name:  (*)
Email:  (*)
Organization:  (*)
Country  (*)

Paper Information

This portion is only for authors.
Each paid registration allows the author to present up to a maximum of 2 papers.
Please give the paper ID(s) and indicate if you are presenting the paper below.
1st Paper ID  
Presenting?  
2nd Paper ID  
Presenting??  

Meals

Vegetarian Meal Requested  
Attending Banquet?  (*)

Tutorial Sessions and Workshop (16 July 2018)

Tutorial sessions are included in the registration. We appreciate if you could indicate which tutorial(s) you are planning to attend so that we can channel resources appropriately.

Session 1

 

T1 -  FinFET & Post-FinFET Advanced Logic Device Reliability– A Review 
(Prof. Aaron Thean, NUS , Singapore)

T2 -  Perspectives of Fault Isolation and Technology Concepts for High Data Rate Ics
(Prof. Christian Boit, Technical University of Berlin, Germany)

Session 2

 

T3 -  BEOL Reliability;  from FinFETs to More-than-Moore Device 
(Dr. Jeff Gambino, ON Semiconductor , USA)

T4 -  SiP, Packaged Stacked Devices and other Challenging 3D Assembly Analysis
(Dr. Philippe Perdu, CNES, France)

Session 3

 

T5 -  Focused Ion Beam (FIB) Chip Circuit Edit Tutorial
(Steven B. Herschbein, GLOBALFOUNDRIES, USA)

T6 -  Physical Analysis with the TEM - Possibilities and Challenges
(Dr. Michel Bosman, IMRE, Singapore)

Session 4

 

T7 -  Intrinsic Reliability Challenges for Non-Volatile Memory Technologies 
(Dr. Robin Degraeve, IMEC , Belgium)

T8-  Defect localization using SEM based current imaging
(Michél Simon-Najasek, IMWS, Germany)

Workshop
(6.30 – 8.30pm)

Fault Isolation Workshop (Sponsored by Hamamatsu)
(Light refreshment will be provided before the workshop)

Note: Tutorial/workshop sessions arrangement are tentative and can be subjected to change


Session 1  
Session 2  
Session 3  
Session 4  
Attending Workshop?  

Technology Showcase

Date: 16th July, Monday
Time: 4.30pm - 6pm
Venue: level 4 MBS Orchid ballroom
* light dinner will be provided

Indicate your attendance below. Registration is on a first-come-first-served basis. Only 40 seats available!
Technology Showcase  (*)

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